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Institute for Advanced Simulation (IAS)

Materials Data Science and Informatics (IAS-9)

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          • Materials Theory, Modeling and Simulation
            • ▾Dislocation Plasticity Modelling
            • ▾Contact and Friction Mechanics
            • ▾Dislocation Behavior in Semiconductors
            • ▾Microstructure Evolution in Solid Solution Strengthened Nickel Alloy under Thermomechanical Loading
            • ▾Modeling Fracture in the High and Very High-Cycle Fatigue Range
            • ▾Modeling Nanoindentation
          • Data Analysis and Machine Learning
            • ▾Materials Data Science
            • ▾Data Mining for collecting previously unavailable information
          • Concepts and Tools for Research Data Management
            • ▾Software Development
            • ▾FAIR data interoperability, Ontology & Knowledge Graph Development
            • ▾Outreach & Community Interaction
          • Collaborations
            • ▾Helmholtz Association
            • ▾National Collaborations
            • ▾International Collaborations
          • Publications
            • ▾Journal Articles
            • ▾Book Chapters
            • ▾Conference Proceedings and Other Publications
        • See Overview Teaching

          • Introduction to Data Mining and Machine Learning
            • Materials Data Science and Informatics
            • See Overview Career

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                Book Chapters

                Book chapters

                • Nguyen, B.D. ; Sandfeld, S. Novel Theoretical Approaches for Understanding and Predicting Dislocation Evolution and Propagation. In Wide Bandgap Semiconductors for Power Electronics (eds P. Wellmann, N. Ohtani and R. Rupp) (2021) https://doi.org/10.1002/9783527824724.ch8
                • Strobl, R., Budnitzki, M., Sandfeld, S. Properties of Phase Microstructures and Their Interaction with Dislocations in the Context of TRIP Steel Systems. In: Biermann, H., Aneziris, C. (eds) Austenitic TRIP/TWIP Steels and Steel-Zirconia Composites (2020) https://doi.org/10.1007/978-3-030-42603-3_23
                Last Modified: 02.11.2022
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