We are developing implantable stealth neurotechnology using flexible, tissue-like materials and designs to create a stable interface between nervous tissues and neuroelectronic devices. Our devices consist of electrical contacts embedded in insulating polymers, such as polyimide, parylene-C, or silicone rubbers, such as polydimethylsiloxane. To electrically couple with neural targets and ensure electrical recording and stimulation capabilities, we utilize various conductive materials that offer distinct electrochemical properties, including the high electrical conductivity of gold and the low impedance and high charge injection capacity provided by materials such as iridium oxide and conductive polymers like PEDOT:PSS.

We also employ advanced microfabrication techniques, including UV photolithography, E-beam lithography, two-photon lithography, and micro-molding, to achieve submicron and micron-scale lithographic resolution. These processes enable the creation of novel designs that enhance the spatial resolution of our devices, ranging from single-cell precision to millimeter-scale coverage. A typical neural implant consists of a printed circuit board (PCB) to enable connectivity with external electronics, a flexible cable for signal transmission, and a sensing region containing an array of microelectrodes for neural interfacing.

Our neurotechnology portfolio includes transparent surface implants (e.g., micro electrocorticography arrays - µECoGs) and penetrating devices, which range from single polymeric threads to comb-like and needle-like structures with multiple electrode sites. Next-generation technologies incorporate micro- and nano-structured topologies and neural cellular assemblies as stealthy substrate coatings to establish a biohybrid neural interface.